合肥芯明智能科技有限公司

芯明创立于2020年，是一家专注空间智能芯片及产品设计的高科技企业。芯明自研系列芯片是目前全球唯一单芯片集成芯片化实时3D立体视觉感知、端侧AI、SLAM（实时定位建图）的系统级芯片，其产品解决方案已在全球范围内应用在泛机器人、XR、消费电子、物流无人机、3D扫描等多个前沿应用领域的龙头企业产品中。 Hefei XinMing Technology Co., Ltd. is a high-tech enterprise specializing in spatial intelligence chips and product design. Xinming’s self-developed chip series is currently the world’s only system-on-chip that integrates on-chip real-time 3D stereo vision perception, on-device AI, and SLAM on a single chip. Its product solutions have been deployed globally in leading enterprise products across multiple cutting-edge application fields, including general robotics, XR, consumer electronics, logistics drones, 3D scanning, etc.